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  1. #1531
    GIF Master Avatar de tiran
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    Boas!
    Será uma meia duzia de frames face á actual geração...

    Na geração do 7700k já será umas boas dezenas de frames de diferença (isto claro se tiveres um GPU que acompanhe o processamento do cpu).

    Vejo esta próxima geração a última que irá tirar performance do 1440p, a partir desta geração para a frente o foco será o 4k.

    Cumprimentos,

    LPC
    Bro todos os benchs que vi não vi nenhum jogo em que o 7700K fique a dezenas de frames de qualquer ryzen... A uma dezena? Posso ter visto... Largas? Negativo...
    Em renderings e outras cenas leva uma pedrada... Mas em jogos?
    E acredita que não é puxar a brasa à minha sardinha porque eu estou mesmo à espera de um motivo válido para trocar...
    GOD OF AWESOME SIGNATURES - KING OF GIFS - TRIGGER OF TROLLS



  2. #1532
    O Administrador Avatar de LPC
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    Bro todos os benchs que vi não vi nenhum jogo em que o 7700K fique a dezenas de frames de qualquer ryzen... A uma dezena? Posso ter visto... Largas? Negativo...
    Em renderings e outras cenas leva uma pedrada... Mas em jogos?
    E acredita que não é puxar a brasa à minha sardinha porque eu estou mesmo à espera de um motivo válido para trocar...
    Boas! falo sobre a troca para o zen 3...

    Ai já vais levar com uma valente "sova" de gerações de cpu...

    Claro que é tudo chinês se me disseres que estás limitado pela gráfica...

    Cumprimentos,

    LPC
    My Specs: .....
    CPU: AMD Ryzen 9 3900X - 4.3Ghz @ 1.30v - Board: MSI AMD B450M Mortar MAX - RAM: 16 GB DDR4 G.Skill RipJaws V 3200Mhz CL14 - GPU: MSI AMD Radeon RX 5700XT Gaming X 8GB - Monitor: BenQ EW3270U 4k HDR
    Case: Tt Core V21 - Cooling: 5x Arctic Cooling P14 PWM PST - CPU Cooler: Alphacool Eisbaer 240 + 2x GT AP-15 - Storage: ADATA XPG SX8200 Pro NVMe 1TB + WD SN520 NVMe 512GB - PSU: Corsair HX1200i 1200W

  3. #1533
    Moderador Avatar de Winjer
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    Com as consolas a passarem a ter 8C16T, em breve vamos ver uma maior diferença entre o 770K e um 3700X ou um 4700X.
    Em 2021, vamos ter um bom salto na exigência de jogos, a nível de CPU.
    Ryzen R5 3600X / Noctua NH-D15 / ASUS Rog Strix X370 / Cooler Master H500 Mesh / 16Gb DDR4 @ 3800mhz CL16 / Gigabyte RTX 2070 Super / Seasonic Focus GX 750W / Sabrent Q Rocket 2 TB / Crucial MX300 500Gb + Samsung 250Evo 500Gb / Edifier R1700BT

  4. #1534
    GIF Master Avatar de tiran
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    Boas! falo sobre a troca para o zen 3...

    Ai já vais levar com uma valente "sova" de gerações de cpu...

    Claro que é tudo chinês se me disseres que estás limitado pela gráfica...

    Cumprimentos,

    LPC
    Espero bem que sim...

    Citação Post Original de Winjer Ver Post
    Com as consolas a passarem a ter 8C16T, em breve vamos ver uma maior diferença entre o 770K e um 3700X ou um 4700X.
    Em 2021, vamos ter um bom salto na exigência de jogos, a nível de CPU.

    Bem é mais um ano com hardware vintage...
    GOD OF AWESOME SIGNATURES - KING OF GIFS - TRIGGER OF TROLLS



  5. #1535
    Moderador Avatar de Winjer
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    Intel Reorganizes In Wake of 7nm Woes; Chief Engineering Officer Murthy Renduchintala To Depart

    Coming in the wake of last week’s disclosure that their 7nm yields are roughly a full year behind schedule, Intel this afternoon has announced that they are reorganizing the technology side of the company. Key to this change is that Intel is breaking up its monolithic Technology, Systems Architecture and Client Group (TSCG) into several smaller groups, all of which will report directly to CEO Bob Swan. Meanwhile Intel’s chief engineering officer, Dr. Murthy Renduchintala, who had been leading the TSCG, will be departing the company at the end of next week. The reorganization is effective immediately.
    As a result of this reorganization, TSCG is being broken up into five groups focusing on manufacturing and architecture. These are:

    • Technology Development: Focused on developing next-generation process nodes. Led by Dr. Ann Kelleher.
    • Manufacturing and Operations: Focused on ramping current process nodes and building out new fab capacity. Led by Keyvan Esfarjani.
    • Design Engineering: A recently-created group responsible for Intel’s technology manufacturing and platform engineering. Led on an interim basis by Josh Walden while Intel searches for a permanent leader.
    • Architecture, Software and Graphics: Developing Intel’s architectures and associated software stacks. Led by Raja Koduri (continuing).
    • Supply Chain: Handling Intel’s supply chain and relationships with important suppliers. Led by Dr. Randhir Thakur (continuing).

    It should be noted that while Intel’s brief announcement does not mention last week’s disclosure, the timing and resulting personnel changes are unmistakably related to the 7nm delay. Today’s reorganization is the second shuffle for Intel in as many months, as the company reorganized a number of product groups after Jim Keller departed for (honest to goodness) personal reasons.
    Meanwhile, TSCG’s former president, Dr. Murthy Renduchintala, will be departing the company on August 3rd. Renduchintala joined Intel in 2015, and for most of the past half-decade has been responsible for overseeing all of TSCG’s efforts, and especially involved in the development of the company’s next-generation process nodes. Intel’s reorganization announcement makes no specific mention of Renduchintala beyond his date of departure, however it is difficult to imagine that this is anything other than Intel pushing out Renduchintala in light of their process woes. More than anything else, Renduchintala was the face of Intel’s monolithic, vertically-integrated design and manufacturing strategy; a strategy that is no more as Intel seriously investigates building parts of leading-edge processes at competing fabs.

    Going forward, the task of developing Intel’s 7nm and 5nm process nodes will be led by Dr. Ann Kelleher. Kelleher gets the incredibly important (but less-than-enviable) challenge of getting Intel’s fab development process back on track, as Intel seeks to regain its crown as the world’s leading chip fab. Kelleher was previously the head of Intel’s manufacturing group, overseeing the recent ramp-up of Intel’s 10nm process. Meanwhile Dr. Mike Mayberry, a central figure in Intel’s labs who was already set to retire this year, will be staying on until then to assist in the transition.
    Overall, while Intel’s reorganization is unlikely to dramatically change the company’s day-to-day operations, it’s very much the start of a new era for the company. As Intel’s ongoing manufacturing woes have driven them to look towards outside fabs for more products, the company’s traditional vertically-integrated structure is less than ideally suited for the task – and as much as Intel manufacturing would like to keep Intel-designed products within the company, Intel’s chip and architecture groups need to be able to freely look elsewhere. And this reorganization is going to be an important step in enabling that.
    Ryzen R5 3600X / Noctua NH-D15 / ASUS Rog Strix X370 / Cooler Master H500 Mesh / 16Gb DDR4 @ 3800mhz CL16 / Gigabyte RTX 2070 Super / Seasonic Focus GX 750W / Sabrent Q Rocket 2 TB / Crucial MX300 500Gb + Samsung 250Evo 500Gb / Edifier R1700BT

  6. #1536
    Moderador Avatar de Winjer
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    Intel Suffers Apparent Data Breach, 20GB of IP and Documents Leaked on to Internet


    Intel today became the apparent victim of a massive internal data breach, as roughly 20 GB of various Intel documents and tools have begun showing up in a data cache uploaded to the wider internet. With materials seemingly spanning over a decade, the breach reportedly includes everything from Intel presentation templates to BIOS code and debugging tools, and would represent one of the biggest intellectual property leaks from a chipmaker in years.
    Released by Till Kottmann, a Swiss software engineer and open security advocate, Kottmann has stated that this is the first of several planned Intel IP releases, calling this first release the “Intel exconfidential Lake Platform Release”. According to tweets posted by Kottmann, he received the material from an anonymous source who breached Intel earlier this year. Meanwhile, ZDNet reports that Kottmann is a regular figure in IP leaks, and has published a number of other tech company leaks before.
    Responding to this leak, Intel this afternoon has issued a brief statement to the press acknowledging the leak, and stating that they believe it came form the Intel Resource and Design Center, a secure Intel repository for third party partners to access various confidential documents and schematics.
    We are investigating this situation. The information appears to come from the Intel Resource and Design Center, which hosts information for use by our customers, partners and other external parties who have registered for access. We believe an individual with access downloaded and shared this data.
    While AnandTech has not validated the contents of the data cache, I’ve heard from one source who has seen it that there are signed NDA documents in there mentioning an Intel partner. So while Intel may be right about the source of the data, the actual breach may have occurred with a partner rather than the actual Intel repository, or in concert with a breach of Intel’s repository.
    Overall, Kottmann claims that the leak has a wide collection of various Intel confidential and NDA’d documents and tools, including:

    • Intel ME Bringup guides + (flash) tooling + samples for various platforms
    • Kabylake (Purley Platform) BIOS Reference Code and Sample Code + Initialization code (some of it as exported git repos with full history)
    • Intel CEFDK (Consumer Electronics Firmware Development Kit (Bootloader stuff)) SOURCES
    • Silicon / FSP source code packages for various platforms
    • Various Intel Development and Debugging Tools
    • Simics Simulation for Rocket Lake S and potentially other platforms
    • Various roadmaps and other documents
    • Binaries for Camera drivers Intel made for SpaceX
    • Schematics, Docs, Tools + Firmware for the unreleased Tiger Lake platform
    • (very horrible) Kabylake FDK training videos
    • Intel Trace Hub + decoder files for various Intel ME versions
    • Elkhart Lake Silicon Reference and Platform Sample Code
    • Some Verilog stuff for various Xeon Platforms, unsure what it is exactly.
    • Debug BIOS/TXE builds for various Platforms
    • Bootguard SDK (encrypted zip)
    • Intel Snowridge / Snowfish Process Simulator ADK
    • Various schematics
    • Intel Marketing Material Templates (InDesign)

    Thus far, while no one has reported finding anything quite as sensitive as Intel CPU or GPU design schematics – which is consistent with the claim that it originated from Intel's Resource and Design Center. None the less, the material in the leak looks to be quite valuable, and potentially damaging in the long run. Firmware blobs are particularly interesting, as while these would need to be reverse engineered to extract useful information out of them, they could potentially contain significant information that hasn’t otherwise been shared before.
    Otherwise, in a bit of situational irony, this leak is likely to cast doubt upon all future Intel leaks. The inclusion of the company’s presentation templates, while not particularly damaging to Intel, would mean that it’s now trivial to generate fake but accurate-looking Intel roadmaps and presentations. These kinds of materials are already regularly faked, but now it’s easier than ever to do so.
    Ultimately with no reason to doubt Kottmann’s claims, it would seem that this just the start of a run of leaks for Intel. And while the company will no doubt be doing everything possible to stop the process, whether they have any legal power to do so remains to be seen.
    Ryzen R5 3600X / Noctua NH-D15 / ASUS Rog Strix X370 / Cooler Master H500 Mesh / 16Gb DDR4 @ 3800mhz CL16 / Gigabyte RTX 2070 Super / Seasonic Focus GX 750W / Sabrent Q Rocket 2 TB / Crucial MX300 500Gb + Samsung 250Evo 500Gb / Edifier R1700BT

 

 
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