380W TDP "base"
380W TDP "base"
Ryzen R5 3700X / Noctua NH-D15 / B550 AORUS ELITE V2 / Cooler Master H500 Mesh / 16Gb DDR4 @ 3800mhz CL16 / Gigabyte RTX 2070 Super / Seasonic Focus GX 750W / Sabrent Q Rocket 2 TB / Crucial MX300 500Gb + Samsung 250Evo 500Gb / Edifier R1700BT
Intel Board of Directors Elects New Chairman and New DirectorEsperemos que isto signifique que a Intel vai voltar à carga e dê concorrência à AMD.Intel Corporation announced today that at the company's Jan. 15 board meeting Andy D. Bryant stepped down as chairman and the board elected lead independent director Dr. Omar Ishrak to succeed Bryant as an independent chairman, effective immediately. Intel also announced that Alyssa Henry was elected to Intel's board. Her election marks the seventh new independent director added to Intel's board since the beginning of 2016.
Bryant will remain on the board through the end of Intel's 2020 annual stockholders' meeting. He had previously notified the board in March 2019 that he did not intend to stand for re-election at this year's meeting. Bryant made the decision to leave the role now in order to facilitate an effective transition.
"I want to thank and congratulate Andy for over seven years' service as chairman of the board," said Intel CEO Bob Swan. "Andy has been a rudder for Intel during a time of change and transformation. He has led the board with integrity and always with Intel's best interest in mind."
"It has been my great honor to serve as Intel chairman, and I plan to retire from the board in May with great optimism about Intel's future," Bryant said. "I have full confidence in Omar leading the board, which is fortunate to have his expertise at leading an innovative, global company. In addition, Alyssa's wealth of senior leadership, cloud computing and emerging technologies experience further strengthens Intel's board."
Henry, 49, has served as seller lead for Square Inc. — a provider of software, hardware and financial services for small businesses and individuals — since 2014. She oversees global engineering, product management, design, sales, marketing, partnerships and support for Square's seller-facing software and financial services products. Prior to Square, she served in various positions with Amazon.com Inc. from 2006 to 2014, including as vice president of Amazon Web Services Storage Services, where she led services including Amazon S3, Amazon EBS and Amazon Lambda; and as Amazon's director of software development for ordering, with responsibility for Amazon's ordering workflow software and databases. Before Amazon, Henry spent 12 years at Microsoft Corp. working on databases and data access technologies in a variety of engineering, program management and product unit management roles. Henry started her career as a developer in the financial services industry. She has served as a member of the board of directors of Unity Technologies, a privately held company, since December 2018.
Ryzen R5 3700X / Noctua NH-D15 / B550 AORUS ELITE V2 / Cooler Master H500 Mesh / 16Gb DDR4 @ 3800mhz CL16 / Gigabyte RTX 2070 Super / Seasonic Focus GX 750W / Sabrent Q Rocket 2 TB / Crucial MX300 500Gb + Samsung 250Evo 500Gb / Edifier R1700BT
CacheOut is the Latest Speculative Execution Attack for Intel ProcessorsMais um mês, mais uns buracos...Another day, another speculative execution vulnerability found inside Intel processors. This time we are getting a new vulnerability called "CacheOut", named after the exploitation's ability to leak data stored inside CPU's cache memory. Dubbed CVE-2020-0549: "L1D Eviction Sampling (L1Des) Leakage" in the CVE identifier system, it is rated with a CVSS score of 6.5. Despite Intel patching a lot of similar exploits present on their CPUs, the CacheOut attack still managed to happen.
The CacheOut steals the data from the CPU's L1 cache, and it is doing it selectively. Instead of waiting for the data to become available, the exploit can choose which data it wants to leak. The "benefit" of this exploit is that it can violate almost every hardware-based security domain meaning that the kernel, co-resident VMs, and SGX (Software Guard Extensions) enclaves are in trouble. To mitigate this issue, Intel provided a microcode update to address the shortcomings of the architecture and they recommended possible mitigations to all OS providers, so you will be protected once your OS maker releases a new update. For a full list of processors affected, you can see this list. Additionally, it is worth pointing out that AMD CPUs are not affected by this exploit.
Ryzen R5 3700X / Noctua NH-D15 / B550 AORUS ELITE V2 / Cooler Master H500 Mesh / 16Gb DDR4 @ 3800mhz CL16 / Gigabyte RTX 2070 Super / Seasonic Focus GX 750W / Sabrent Q Rocket 2 TB / Crucial MX300 500Gb + Samsung 250Evo 500Gb / Edifier R1700BT
Intel Core i7-10700K Features 5.30 GHz Turbo BoostIntel's 10th generation Core "Comet Lake-S" desktop processor series inches chose to its probable April 2020 launch. Along the way we get this fascinating leak of the company's Core i7-10700K desktop processor, which could become a go-to chip for gamers if its specifications and pricing hold up. Thai PC enthusiast TUM_APISAK revealed what could be a Futuremark SystemInfo screenshot of the i7-10700K which confirms its clock speeds - 3.80 GHz nominal, with an impressive 5.30 GHz Turbo Boost. Intel is probably tapping into the series' increased maximum TDP of 125 W to clock these chips high across the board.
The Core i7-10700K features 8 cores, and HyperThreading enables 16 threads. It also features 16 MB of shared L3 cache. In essence, this chip has the same muscle as the company's current mainstream desktop flagship, the i9-9900K, but demoted to the Core i7 brand extension. This could give it a sub-$400 price, letting it compete with the likes of AMD's Ryzen 7 3800X and possibly even triggering a price-cut on the 3900X. The i7-10700K in APISAK's screenshot is shown running on an ECS Z490H6-A2 motherboard, marking the company's return to premium Intel chipsets. ECS lacks Z390 or Z370 based motherboards in its lineup, and caps out at B360.
Ryzen R5 3700X / Noctua NH-D15 / B550 AORUS ELITE V2 / Cooler Master H500 Mesh / 16Gb DDR4 @ 3800mhz CL16 / Gigabyte RTX 2070 Super / Seasonic Focus GX 750W / Sabrent Q Rocket 2 TB / Crucial MX300 500Gb + Samsung 250Evo 500Gb / Edifier R1700BT
Researchers Find Unfixable Vulnerability Inside Intel CPUsComo de costume com os CPUs da Intel, mais um mês, mas uma dose de buracos...Researchers have found another vulnerability Inside Intel's Converged Security and Management Engine (CSME). For starters, the CSME is a tiny CPU within a CPU that has access to whole data throughput and is dedicated to the security of the whole SoC. The CSME system is a kind of a black box, given that Intel is protecting its documentation so it can stop its copying by other vendors, however, researchers have discovered a flaw in the design of CSME and are now able to exploit millions of systems based on Intel CPUs manufactured in the last five years.
Discovered by Positive Technologies, the flaw is lying inside the Read-Only Memory (ROM) of the CSME. Given that the Mask ROM is hardcoded in the CPU, the exploit can not be fixed by a simple firmware update. The researchers from Positive Technologies describe it as such: "Unfortunately, no security system is perfect. Like all security architectures, Intel's had a weakness: the boot ROM, in this case. An early-stage vulnerability in ROM enables control over the reading of the Chipset Key and generation of all other encryption keys. One of these keys is for the Integrity Control Value Blob (ICVB). With this key, attackers can forge the code of any Intel CSME firmware module in a way that authenticity checks cannot detect. This is functionally equivalent to a breach of the private key for the Intel CSME firmware digital signature, but limited to a specific platform.
Ryzen R5 3700X / Noctua NH-D15 / B550 AORUS ELITE V2 / Cooler Master H500 Mesh / 16Gb DDR4 @ 3800mhz CL16 / Gigabyte RTX 2070 Super / Seasonic Focus GX 750W / Sabrent Q Rocket 2 TB / Crucial MX300 500Gb + Samsung 250Evo 500Gb / Edifier R1700BT
Esta é uma daquelas "fraquezas" da treta.
"The good thing, however, is that to exploit a system, an attacker must have physical access to the hardware in question, as remote exploitation is not possible."
Eu não tenho por hábito deixar hackers sentarem-se no meu escritório de casa, nem mexerem no meu portátil de trabalho... Mas cada um sabe de si.
Dell G15
Lol @SleepyFilipy
Por acaso, em certos ambientes, o maior problema é mesmo as pessoas com acesso ao hardware.
Ainda há uns anos atrás o Pentágono proibiu a entrada de pens USB, pois estas eram a maior causa de problemas de segurança interna. Não eram os hackaros à distância.
Ryzen R5 3700X / Noctua NH-D15 / B550 AORUS ELITE V2 / Cooler Master H500 Mesh / 16Gb DDR4 @ 3800mhz CL16 / Gigabyte RTX 2070 Super / Seasonic Focus GX 750W / Sabrent Q Rocket 2 TB / Crucial MX300 500Gb + Samsung 250Evo 500Gb / Edifier R1700BT
E? O risco de segurança não era em função de uma falha do hardware e sim por conta de pendrives. Suponho que essas pendrives funcionem em qualquer sistema e não em apenas sistemas com Intel. Pelo menos as portas USB no meu AMD também funcionam. A falha de segurança aí está na metodologia de trabalho do Pentágono. Se até na FCA que não é nenhum exemplo de segurança de informação, os portáteis conseguiam ter as portas USB com o seu uso bloqueado a não ser com autorização prévia, o Pentágono não o fez por preguiça.
Pessoas com acesso ao hardware que está aberto para uso geral, é bem diferente de alguém que tenha conhecimento e meios para fazer um acesso através de exploits desses. Essas pessoas que estavam lá, eram estranhos ao serviço e passaram pela segurança do Pentágono assim sem mais nem menos? Ou estamos a falar de pessoas com acesso permitido, que por usarem pendrives se tornavam num risco para a segurança de informação (tipo a secretária do general que tem acesso ao outlook dele)? Não deve ter sido o Julian Assange que passou pela porta despercebido e foi lá copiar arquivos.
Dell G15
O exemplo das pens serve apenas para mostrar que o contacto físico com o hardware também é uma preocupação válida.
Este novo buraco dos CPUs da Intel pode não ser tão grave como os anteriores, mas não deixa de ser mais uma preocupação.
Ryzen R5 3700X / Noctua NH-D15 / B550 AORUS ELITE V2 / Cooler Master H500 Mesh / 16Gb DDR4 @ 3800mhz CL16 / Gigabyte RTX 2070 Super / Seasonic Focus GX 750W / Sabrent Q Rocket 2 TB / Crucial MX300 500Gb + Samsung 250Evo 500Gb / Edifier R1700BT
Em décadas de uso de processadores deles nunca ninguém descobriu nada e ultimamente é uma cena normal descobrir falhas de segurança. Como?
Intel Rocket Lake-S gets PCIe 4.0The Empire Strikes back....The platform codenamed Rocket Lake-S is currently expected in late 2020. The rumors about the RLK-S platform have been floating around the web for a while now, but only now (thanks to our sources at Intel) we are able to provide some concrete information on a new platform.
The leaked diagram we are sharing today is a basic overview of the Rocket Lake-S features. The 500-series motherboards will benefit from many features currently not present on 300- and even the upcoming 400 series motherboards.
Based on the information we have, Rocket Lake-S is a feature update to Comet Lake-S.
Main features of Intel Rocket Lake-S
- The new processor core architecture
The slide confirms that Rocket Lake-S will feature new core architecture, without stating any other details. What is rumored, however, is that Rocket Lake-S is rumored to be 14nm adoption of Tiger Lake, which is using Willow Cove cores.- 20 lanes of PCI Express 4.0
The most important change for Rocket Lake-S is PCIe 4.0 support. Not only will the CPU have direct 4.0 lanes, but there will be 4 additional lanes for storage (x16 for GPU and x4 for NVME drive). This means that both the primary GPU and NVME storage will be attached directly to the CPU, not the PCH.- DMI 3.0 x8
Direct Media Interface will be upgraded to x8 link, which means doubled transfer speed compared to x4. Intel does not state the transfer speed for a new DMI connection, but the current x4 link has a transfer of 8 GT/s (3.93 GB/s).- Intel Xe Graphics and display updates
The slide confirms that Rocket Lake-S will benefit from Xe graphics architecture (further evidence that RKL is a Tiger Lake desktop clone?). The upgrade to Xe (presumably Gen12) will also bring HDMI 2.0b and DisplayPort 1.4a support.- Thunderbolt 4 and USB 3.2 20G
At CES 2020 Intel confirmed that the Tiger Lake platform will support Thunderbolt 4. This standard does not provide an upgrade over Thunderbolt 3 in terms of transfer speed (it is still 40 Gb/s). There has been a rumor that 4.0 might be using PCIe 4.0 but the slide clearly states that TB4.0 is still using PCIe 3.0.- SGX removed
Intel Software Guard Extensions have been removed for Rocket Lake-S.
INTEL Mainstream Desktop CPU Platform Specifications VideoCardz.com Kaby Lake-S Coffee Lake-S Comet Lake-S Rocket Lake-S Alder Lake-S Fabrication Node 14nm 14nm 14nm 14nm (TBC) (TBC) Launch Date 2017 2018 2020 (TBC) (TBC) Chipset Intel 200 Intel 300 Intel 400 Intel 500 Intel 600 Core Series 7th Gen Core-S 8th/9th Gen Core-S 10th Gen Core-S 11th Gen Core-S 12th Gen Core-S Max Core Count up to 4 cores up to 8 cores up to 10 cores TBC up to 16 (TBC) Socket LGA1151 LGA1151 LGA1200 LGA1200 (TBC) LGA1700 (TBC) Memory Support 2ch DDR4 up to 64GB 2ch DDR4 up to 128GB 2ch DDR4 up to 128GB 2ch DDR4 up to (TBC) (TBC) PCIe Support PCIe 3.0 PCIe 3.0 PCIe 3.0 PCIe 4.0 PCIe 4.0 CPU PCIe Lanes 16 (3.0) 16 (3.0) 16 (3.0) 20 (4.0) (TBC) PCH PCIe Lanes 24 (3.0) 24 (3.0) 24 (3.0) 24 (3.0) (TBC) USB up to 10x 3.0
up to 14x 2.0Z370:
up to 10x 3.0
up to 14x 2.0
Z390:
up to 6x 3.1 Gen2x1
up to 10x 3.1 Gen1x13.2 Gen 2×1 (10 Gb/s)
3.2 Gen 1×1 (5 Gb/s)
2.03.2 Gen 2×2 (20 Gb/s)
3.2 Gen 2×1 (10 Gb/s)
3.2 Gen 1×1 (5 Gb/s)(TBC) DMI x4 3.0 x4 3.0 x4 3.0 x8 3.0 (TBC) Integrated WiFi – Wireless-AC Wireless-AX Wireless-AX (TBC) Display Support DisplayPort 1.2
HDMI 1.4DisplayPort 1.2
HDMI 1.4DisplayPort 1.2(1.4)
HDMI 2.0aDisplayPort 1.4a
HDMI 2.0b(TBC) Intel SGX Security 1.0 1.0 1.0 removed (TBC)
Ryzen R5 3700X / Noctua NH-D15 / B550 AORUS ELITE V2 / Cooler Master H500 Mesh / 16Gb DDR4 @ 3800mhz CL16 / Gigabyte RTX 2070 Super / Seasonic Focus GX 750W / Sabrent Q Rocket 2 TB / Crucial MX300 500Gb + Samsung 250Evo 500Gb / Edifier R1700BT
Intel Rocket Lake-S gets PCIe 4.0The Empire Strikes back....The platform codenamed Rocket Lake-S is currently expected in late 2020. The rumors about the RLK-S platform have been floating around the web for a while now, but only now (thanks to our sources at Intel) we are able to provide some concrete information on a new platform.
The leaked diagram we are sharing today is a basic overview of the Rocket Lake-S features. The 500-series motherboards will benefit from many features currently not present on 300- and even the upcoming 400 series motherboards.
Based on the information we have, Rocket Lake-S is a feature update to Comet Lake-S.
Main features of Intel Rocket Lake-S
- The new processor core architecture
The slide confirms that Rocket Lake-S will feature new core architecture, without stating any other details. What is rumored, however, is that Rocket Lake-S is rumored to be 14nm adoption of Tiger Lake, which is using Willow Cove cores.- 20 lanes of PCI Express 4.0
The most important change for Rocket Lake-S is PCIe 4.0 support. Not only will the CPU have direct 4.0 lanes, but there will be 4 additional lanes for storage (x16 for GPU and x4 for NVME drive). This means that both the primary GPU and NVME storage will be attached directly to the CPU, not the PCH.- DMI 3.0 x8
Direct Media Interface will be upgraded to x8 link, which means doubled transfer speed compared to x4. Intel does not state the transfer speed for a new DMI connection, but the current x4 link has a transfer of 8 GT/s (3.93 GB/s).- Intel Xe Graphics and display updates
The slide confirms that Rocket Lake-S will benefit from Xe graphics architecture (further evidence that RKL is a Tiger Lake desktop clone?). The upgrade to Xe (presumably Gen12) will also bring HDMI 2.0b and DisplayPort 1.4a support.- Thunderbolt 4 and USB 3.2 20G
At CES 2020 Intel confirmed that the Tiger Lake platform will support Thunderbolt 4. This standard does not provide an upgrade over Thunderbolt 3 in terms of transfer speed (it is still 40 Gb/s). There has been a rumor that 4.0 might be using PCIe 4.0 but the slide clearly states that TB4.0 is still using PCIe 3.0.- SGX removed
Intel Software Guard Extensions have been removed for Rocket Lake-S.
INTEL Mainstream Desktop CPU Platform Specifications VideoCardz.com Kaby Lake-S Coffee Lake-S Comet Lake-S Rocket Lake-S Alder Lake-S Fabrication Node 14nm 14nm 14nm 14nm (TBC) (TBC) Launch Date 2017 2018 2020 (TBC) (TBC) Chipset Intel 200 Intel 300 Intel 400 Intel 500 Intel 600 Core Series 7th Gen Core-S 8th/9th Gen Core-S 10th Gen Core-S 11th Gen Core-S 12th Gen Core-S Max Core Count up to 4 cores up to 8 cores up to 10 cores TBC up to 16 (TBC) Socket LGA1151 LGA1151 LGA1200 LGA1200 (TBC) LGA1700 (TBC) Memory Support 2ch DDR4 up to 64GB 2ch DDR4 up to 128GB 2ch DDR4 up to 128GB 2ch DDR4 up to (TBC) (TBC) PCIe Support PCIe 3.0 PCIe 3.0 PCIe 3.0 PCIe 4.0 PCIe 4.0 CPU PCIe Lanes 16 (3.0) 16 (3.0) 16 (3.0) 20 (4.0) (TBC) PCH PCIe Lanes 24 (3.0) 24 (3.0) 24 (3.0) 24 (3.0) (TBC) USB up to 10x 3.0
up to 14x 2.0Z370:
up to 10x 3.0
up to 14x 2.0
Z390:
up to 6x 3.1 Gen2x1
up to 10x 3.1 Gen1x13.2 Gen 2×1 (10 Gb/s)
3.2 Gen 1×1 (5 Gb/s)
2.03.2 Gen 2×2 (20 Gb/s)
3.2 Gen 2×1 (10 Gb/s)
3.2 Gen 1×1 (5 Gb/s)(TBC) DMI x4 3.0 x4 3.0 x4 3.0 x8 3.0 (TBC) Integrated WiFi – Wireless-AC Wireless-AX Wireless-AX (TBC) Display Support DisplayPort 1.2
HDMI 1.4DisplayPort 1.2
HDMI 1.4DisplayPort 1.2(1.4)
HDMI 2.0aDisplayPort 1.4a
HDMI 2.0b(TBC) Intel SGX Security 1.0 1.0 1.0 removed (TBC)
Ryzen R5 3700X / Noctua NH-D15 / B550 AORUS ELITE V2 / Cooler Master H500 Mesh / 16Gb DDR4 @ 3800mhz CL16 / Gigabyte RTX 2070 Super / Seasonic Focus GX 750W / Sabrent Q Rocket 2 TB / Crucial MX300 500Gb + Samsung 250Evo 500Gb / Edifier R1700BT
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