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  1. #1501
    Tech Bencher Avatar de reiszink
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    AMD Ryzen 2700X 50th Anniversary Edition

    Gozam com a Intel, mas depois fazem o mesmo.
    Intel i7 5820K - ASRock X99M Killer - 16GB G.Skill DDR4 - Gigabyte GTX 980Ti G1 - Plextor M6e 256GB + Samsung 850 EVO 500GB - Corsair H110 - EVGA G3 750W - Acer 27" 144Hz IPS - Zowie EC2-A - Filco Majestouch 2 TKL - HyperX Cloud II Pro

  2. #1502
    Master Business & GPU Man Avatar de Enzo
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    Quem desdenha...quer vender
    Ideias sem Nexo e Provas do Tráfico de Hardware
    "que personifica o destino, equilíbrio e vingança divina." Dejá vú. Que cena!

  3. #1503
    Tech Iniciado Avatar de Carlinhos
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    Também acho

  4. #1504
    Moderador Avatar de Winjer
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    MSI Issues Clarification on Next-Gen AMD CPU Support on 300-series Motherboards

    It has come to our attention that MSI Customer Support has regrettably misinformed an MSI customer with regards to potential support for next-gen AMD CPUs on the MSI X370 XPOWER GAMING TITANIUM motherboard.
    Through this statement we want clarify the current situation.

    At this point, we are still performing extensive testing on our existing lineup of 300- and 400-series AM4 motherboards to verify potential compatibility for the next-gen AMD Ryzen CPUs.
    To be clear: Our intention is to offer maximum compatibility for as many MSI products as possible.
    Towards the launch of the next-gen AMD CPUs, we will release a compatibility list of MSI AM4 motherboards.

    Below is a full list of upcoming BIOS versions which include compatibility for the next-gen AMD APUs for our 300-Series and 400-Series AM4 motherboards based on the latest AMD Combo PI version 1.0.0.0.
    These BIOS versions are expected to be released in May this year.


  5. #1505
    Moderador Avatar de Winjer
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    [Rumor] Zen2 yields: not as fantastic as Zeppelin yields, but very good!




    Two years ago we wrote about the crazy high yields of Zeppelin dies but, now, we are here to talk about the yelds of Zen2 dies (About 88 mm2).
    According to our sources, the same who told us about the death of Global Foundries 20nm, the fully working Zen2 dies are about the 70% of the total production (A separate discourse needs to be entered into for the frequencies).

    Despite it doesn't sound great at first sight, that's a very good news. If we think that a fully working Intel XCC die (28 cores) has a rumored yield of 35%, this means that a 64C EPYC2 CPU has got a yield rate of 70% (8 x 8 dies).
    Almost the double of Intel yield rate!


    Se isto for verdade, são excelentes noticias para a AMD e para os consumidores.

  6. #1506
    Moderador Avatar de Winjer
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    A serem apresentadas oficialmente no dia 1 de Junho, na Computex.

    BIOSTAR X570 Racing Series Motherboard Teased, Built For Next-Gen AMD Ryzen 3000 CPUs With PCIe Gen 4.0 Support

    The motherboard which is pictured seems to be a top of the line X570 racing series product from BIOSTAR.
    It seems to feature a full black color theme with silver accents that are part of the racing series lineup.
    The VRM is cooled off by two metallic fin heatsinks and we can also see the AM4 CPU socket next to the four DDR4 DIMM slots.
    The motherboard battery tray is located right next to the I/O cover which should be easier to approach if you’re using multiple expansion cards which can make reaching the battery a hassle.

    The motherboard comes with three PCIe 4.0 x16 slots, two of which are protected by a metal brace.
    PCIe Gen 4 is confirmed for AMD’s X570 platform so we should see all future AM4 boards supporting the new standard. There are also three PCIe 4.0 x1 slots which can be used for network or storage AICs.
    There are three M.2 slots out of which one is full length. All M.2 slots feature the heatsink to keep your NVMe drives running cooler.
    The PCH heatsink which is situated on top of the X570 chipset is actively cooled by a 7-blade fan.



    BIOSTAR is going to provide the user the ability to switch if off or on for lower noise.
    On the I/O, we get a range of connectors which include DisplayPort, HDMI, DVI, PS/2, four USB 3.1 Gen1, two USB 3.1 Gen 2 (Type-A + Type-C), a Gigabit Ethernet LAN port and a 7.1 channel HD audio jack.
    The X570 Racing motherboard from BIOSTAR seems like a very solid option.
    From what I can tell by reading the PR, I think BIOSTAR will have more than just one X570 motherboard displayed at their booth.

    4th Generation RACING Series and Next Gen-Gaming Solutions

    The BIOSTAR RACING Series of high-performance motherboards feature the latest technologies for performance and aesthetics.
    The BIOSTAR RACING Series is geared towards gamers and power users that demand performance with great stability and reliability.
    BIOSTAR will be demonstrating the 4th generation RACING Series powered by the next-generation AMD Ryzen processors to highlight its capabilities in gaming, entertainment, and professional use.

  7. #1507
    Moderador Avatar de Winjer
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    AMD Ryzen 3000 Processor Samples Clock Up To 4.5 GHz, Feature 15% Better IPC

    According to the source, motherboard manufacturers have already been playing around with the AMD Ryzen 3000 CPU samples which they received earlier in Q1 2019.
    In our previous report, we also confirmed from our own sources that motherboard makers have been supplied quad-core Zen 2 CPU samples to test them with their upcoming products.
    These CPUs were early samples which were only supplied for internal testing and not necessarily indicate final retail performance or clock speeds

    The report states that the samples allegedly feature a 15% boost in terms of IPC which would be a good increase over existing Zen+ based parts that already lifted the IPC by 3% over Ryzen 1st Gen CPUs.
    It is also reported that the boost frequency for these samples is reported at up to 4.5 GHz which should scale better with higher core and higher TDP parts.
    It looks like AMD would make a serious focus on the efficiency of their 7nm processors while delivering a good boost in processor performance over the last generation parts.

    It is also reported that the memory controller has got an upgrade but it isn’t as significant as we had expected.
    Still, it would be nice to see Ryzen 3000 series running along well with the higher clocked DDR4 DIMM kits (4000 MHz+).
    The report also goes in line with the IPC improvements we had expected for the Ryzen 3000 series processors, coming in the 10-15% range.

    AMD X570 Reportedly Offers 40 PCIe Gen 4 Lanes, No Ryzen 3000 Support on A320 Chipset

    The same report also states that the X570 platform offers 40 PCIe Gen 4 lanes which would be available from the CPU and PCH.
    This means that the Ryzen CPUs and X570 PCH will split the Gen4.0 lanes over tons of I/O.
    A leaked data sheet shows that the X570 PCH is classified in the Enthusiast segment with 16 lanes dedicated to PCIe Gen 4 expansion slots (8+4+4), 8 USB 3.1 Gen 2, 4 USB 2.0, 3 SATA ports (4+4+4_ and an x4 Gen 4 PCIe Uplink port.
    The rest of the PCIe Gen 4 expansion would run over the CPU lanes.



    It is also said that X570 motherboards have encountered a problem with the PCIe 4.0 speeds and a new version of the motherboards are being tested right now which should be ready for launch in a couple of months when Ryzen 3000 series officially hits the market.
    While X570 is the enthusiast tier PCH, there would also be B550 casual audiences but would lack PCIe Gen 4.0 support.

  8. #1508
    Tech Veterano Avatar de MTPS
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    Está quase. Vamos ver.

  9. #1509
    Tech Bencher Avatar de reiszink
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    Samsung Kills Production of Famed B-die DDR4 Memory in Favor or Higher Densities

    Poderá não ser uma boa noticia, visto que são as memórias que melhor funcionam nos Ryzen!

    Mas, tudo depende das melhorias do Zen 2 nesse capitulo.
    Intel i7 5820K - ASRock X99M Killer - 16GB G.Skill DDR4 - Gigabyte GTX 980Ti G1 - Plextor M6e 256GB + Samsung 850 EVO 500GB - Corsair H110 - EVGA G3 750W - Acer 27" 144Hz IPS - Zowie EC2-A - Filco Majestouch 2 TKL - HyperX Cloud II Pro

  10. #1510
    Moderador Avatar de Winjer
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    O B-die eram as melhores memórias que funcionam em qualquer plataforma. Não só nos Ryzen, mas também em Intel.
    Atualmente já não são sequer as melhores, esse lugar pertence ao Hynix C-Die.
    Para além disso, as Bios do Ryzen melhoraram muito desde o lançamento e agora é possível obter bons resultados mesmo com outros chips.
    Mesmo assim, será de esperar que a Samsung tenha novos chips para alto desempenho, substituindo os famosos B-Die.

  11. #1511
    Tech Mestre Avatar de SleepyFilipy
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    Se alguém quiser B-Die eu tenho para vender, produto raro de coleção xD
    Dell G15

  12. #1512
    Moderador Avatar de Winjer
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    Announcing DRAM Calculator for Ryzen v1.5.0 with an Integrated Benchmark

    Yuri "1usmus" Bubliy, who practically wrote the book on AMD Ryzen memory overclocking, presents DRAM Calculator for Ryzen v1.5.0, the latest version of the most powerful tool available to help you overclock memory on PCs powered by AMD Ryzen processors. The biggest feature-addition is MEMBench, a new internal memory benchmark that tests performance of your machine's memory sub-system, and can be used to test the stability of your memory overclock. Among the other feature-additions include the "Compare Timings" button, which gives you a side-by-side comparison of your machine's existing settings, with what's possible or the settings you've arrived at using the app.

  13. #1513
    Moderador Avatar de Winjer
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    A AMD vai ter os seus produtos a serem utilizados pelo Super-Computador mais rápido do mundo.


  14. #1514
    Moderador Avatar de Winjer
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    AMD Ryzen 3000 "Zen 2" a Memory OC Beast, DDR4-5000 Possible

    AMD's 3rd generation Ryzen (3000-series) processors will overcome a vast number of memory limitations faced by older Ryzen chips.
    With Zen 2, the company decided to separate the memory controller from the CPU cores into a separate chip, called "IO die".
    Our resident Ryzen memory guru Yuri "1usmus" Bubliy, author of DRAM Calculator for Ryzen, found technical info that confirms just how much progress AMD has been making.

    The third generation Ryzen processors will be able to match their Intel counterparts when it comes to memory overclocking. In the Zen 2 BIOS, the memory frequency options go all the way up to "DDR4-5000", which is a huge increase over the first Ryzens.
    The DRAM clock is still linked to the Infinity Fabric (IF) clock domain, which means at DDR4-5000, Infinity Fabric would tick at 5000 MHz DDR, too.
    Since that rate is out of reach for IF, AMD has decided to add a new 1/2 divider mode for their on-chip bus. When enabled, it will run Infinity Fabric at half the DRAM actual clock (eg: 1250 MHz for DDR4-5000).



    This could turn into an additional selling point for AMD X570 chipset motherboards, as they'll have a memory frequency headroom advantage over boards based on older chipsets as their BIOS will include not just the increased memory clock limit, but also the divider mode.
    Of course this doesn't mean that you can just magically overclock any memory kit to these 5 GHz speeds - it's probable that only the best of the best modules will be able to get close to these speeds.

    1usmus also discovered that the platform adds a SoC OC mode and VDDG voltage control.
    We've heard from several sources that AMD invested heavily in improving memory compatibility, especially in the wake of Samsung discontinuing its B-die DRAM chips.

  15. #1515
    Moderador Avatar de Winjer
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    Alguma informação sobre os divisores para as memórias e Infinity Fabric.

    The information comes from the author of the DRAM Calculator for Ryzen processors 1usmus or Yuri Bubliy.
    He has mentioned on his Twitter feed that the maximum value of the frequency of the AMD Zen 2 generation of processors or Ryzen 3000 series is 5000 MHz and the UCLK is half of that so it should be set at 1250 MHz effective.
    The difference between the memory clock and UCLK is that the memory clock is specific only to the internal and external memory clock while the UMC clock is specific to the unified memory controller.
    Following is a set of clock domains for Zen based Ryzen CPUs (via WikiChip):


    • UClk – UMC Clock – The frequency at which the Unified Memory Controller’s (UMC) operates at. This frequency is identical to MemClk.
    • LClk – Link Clock – The clock at which the I/O Hub Controller communicates with the chip.
    • FClk – Fabric Clock – The clock at which the data fabric operates at. This frequency is identical to MemClk.
    • MemClk – Memory Clock – Internal and external memory clock.
    • CClk – Core Clock – The frequency at which the CPU core and the caches operate at (i.e. advertised frequency).

    I think it's time to start
    The maximum value of the frequency of RAM Zen 2 generation is 5000 MHz mode UCLK == MEMCLK / 2.




    — Юрий (@1usmus) May 10, 2019

    Now as a reference, the Ryzen 7 1700 had a core clock of 3000 MHz with 2400 MT/s memory and a UClk of 1200 MHz (600 MHz effective).
    Now the one thing to consider is that the Infinity Fabric clock is also tied to the memory clock and since Infinity Fabric cannot hit 5000 MHz, it will actually run at half the speed of the memory clock.

    Now one thing to consider is while up to 5000 MHz is the maximum speed that can be achieved on the upcoming generation of Ryzen processors, not all CPUs may be able to hit those speeds.
    There are still some things to consider as currently, 2nd Generation Ryzen processors have a max speed of 4000 MHz listed but they can’t reach those speeds.
    Only overclockers might be able to hit the 5 GHz memory speed limits using LN2 but from a consumer perspective, these speeds may be far from reachable.

    However, the X570 motherboards should allow for better memory clocks and support using Zen 2 processors compared to existing X470 and X370 products.
    The memory speeds supported by the new chips would indeed be better than what we got from the 1st and 2nd Gen Ryzen chips.
    That would definitely stir up some interest from the masses along with the added support for PCI-e Gen 4.0 which is something that the consumer market has been looking forward to for years now.

 

 
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