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  1. #121
    Tech Ubër-Dominus Avatar de Jorge-Vieira
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    TSMC gearing up for 10nm FinFet this year and getting 5nm by 2020

    During TSMC's earning's call, they revealed that they're expecting to begin the process of switching over to 10nm production, ramping it up fully into 2017.


    16nm and FinFet are relatively new processes with GPU manufacturers just now taking advantage of a more complete production process and higher yields. Now that those are mature processes they can concentrate on perfecting 10nm, which will likely be somewhat of a challenge, though the market should transition to the new process as demand for 20nm and even 16nm slowly drops as they ramp up. They plan on capturing a large part of the market share with their early introduction of the process.

    They've already taped out working devices based on the node, but aren't quite ready for full production. They did invest heavily into research into 10nm back in 2014. We should see actual hardware using this process, likely mobile hardware first, in 2017. Intel is also slated to have their 10nm node ready in 2017 after delaying it past their initial 2016 release date.

    Their roadmap lines up perfectly with the rumor that Qualcomm's Snapdragon 830 will be using 10nm, though they're likely to use Samsung who already has shown off a working 10nm FinFet technology.

    In the same earnings call it was said that TSMC is still on track for having 5nm FinFet ready in 2020, though it's still too early to make any promises, and complications can certainly arise before then that make it more difficult to manufacture.

    Interestingly, 10nm isn't a true 10nm design like it used to be in the past, where it referred to both the half-pitch and the gate length. Now those two metrics could differ in size, with perhaps the half-pitch being larger and relying on older more mature fabrication technologies. That has it's advantages and disadvantages, mostly being that newer, smaller processes can be introduced more quickly.

    Noticia:
    http://www.tweaktown.com/news/50017/...020/index.html
    http://www.portugal-tech.pt/image.php?type=sigpic&userid=566&dateline=1384876765

  2. #122
    Tech Ubër-Dominus Avatar de Jorge-Vieira
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    TSMC gets green light for China fab plans

    Taiwan Semiconductor (TSMC) has received permission to build a £2 billion 12" wafer fab in China's Nanking region, thanks to relaxing investment regulations.


    Taiwanese officials have given local semiconductor fabrication specialist TSMC the green light to build a £2 billion facility on China's mainland.

    Taiwan Semiconductor, better known as TSMC, announced the plan to build the £2 billion 12" wafer fabrication facility in China's Nanking region in December last year, but was blocked by rules put in place by the Investment Commission of Taiwan's Ministry of Economic Affairs regarding local companies making large-scale technology investments in China. Spurred by relaxing tensions between Taiwan and China, the rules have been gradually slackening to the point where the Investment Commission has now given the go-ahead for TSMC to begin building the facility.

    The company hopes that, even with this regulatory delay, the plant will be up and running to produce 16nm parts on 12" wafers by 2018 and will scale to a volume of 20,000 wafers per month - many of which will be sold to Chinese customers. The facility will be supported by a local design service centre.

    The expansion comes as TSMC claims to be ready to tape out its first 10nm process parts, aiming to leapfrog industry leader Intel to the new process node. This forms the central premise of the company's extremely aggressive roadmap, which promises a shift to 7nm by 2018 and 5nm by 2020 - despite the considerable engineering challenges posed by the laws of physics at such small feature sizes
    Noticia:
    http://www.bit-tech.net/news/hardwar...fab-go-ahead/1
    http://www.portugal-tech.pt/image.php?type=sigpic&userid=566&dateline=1384876765

  3. #123
    Tech Ubër-Dominus Avatar de Jorge-Vieira
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    Earthquake might have damaged TSMC production



    The Gods are not happy with the iPhone 7
    Although it was thought that the earthquake in Taiwan might have had a limited impact on the production of electronics, rumours are flying that all is not well at TSMC.

    The earthquake with a moment magnitude of 6.4 struck Taiwan on February 8. It has left 116 confirmed dead. However what is worrying the Tame Apple Press are worried is that
    TSMC is where the next iPhone 7 is going to come from and they are just starting to program fanboys to think that the iPhone6se is not the chocolate teapot that anyone with any sense would think.
    To make matters worse Apple late last year decided that it was going to snub Samsung and put the production of all its A-series chips into TSMC’s hands. Putting all your eggs in one basket is the sort of sane business choice which any company who has experienced supply problems before would do. After all what could possibly go wrong?
    It does look like TSMC is flat out with the repairs. Officially it is believed that TSMC is expected to have 95% of its production capacity restored in the next three days, and that the long-term impact would only be a loss of 1 per cent of their 2016 production. But it is also rumoured that damage to one of their chip fabrication facilities was worse than originally assessed and repairs might drag on.
    It is unclear if this will slow down production of the iPhone, or if more importantly it will effect some of the business plans of other companies’ chip projects.
    Noticia:
    http://www.fudzilla.com/news/process...smc-production


    Vamos a ver quais os produtos que vão sofrer atrasos por este motivo.
    http://www.portugal-tech.pt/image.php?type=sigpic&userid=566&dateline=1384876765

  4. #124
    Tech Ubër-Dominus Avatar de Jorge-Vieira
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    TSMC to Double 16nmFF+ Chip Production


    After the recent Taiwanese earthquake, many Nvidia and AMD watchers may have worried about their upcoming Pascal and Polaris GPUs. While TSMC did eventually reveal that there would be a hit to their chip production, especially 16nm, it seems like things should be fine. According to the latest reports, TSMC is planning to double their 16nm wafer production from 40,000 per month up to 80,000 per month.
    While this number may still be slightly depressed due to the earthquake, it does mean TSMC is taking in more 16nm orders and is able to supply them. Nvidia is relying on TSMC to supply them with 16nmFF+ GPUs for use with Pascal which is set to launch later this year. A ramp up now would mean the a mid-2016 launch for the earliest Pascal chips, right in line with rumours. For AMD, TSMC will play a lesser role as Polaris may be using GlobalFoundries 14nmLPP exclusively.
    One snag in the above analysis is that these maybe Apple A10 SoCs. Apple has been moving away from Samsung as their main chip supplier and Apple may be starting to ramp up iPhone SoC orders. Either way, the fact that 16nmFF+ is doing well means the earthquake likely won’t affect chip supply and prices.
    Noticia:
    http://www.eteknix.com/tsmc-double-1...ip-production/
    http://www.portugal-tech.pt/image.php?type=sigpic&userid=566&dateline=1384876765

  5. #125
    Tech Ubër-Dominus Avatar de Jorge-Vieira
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    TSMC advanced wafer plant in China


    $3 billion investment in 12-inch fab
    TSMC is building a 12-inch fab Nanjing City Government and will write a cheque for $3 billion as part of the deal.

    TSMC, which already has an 8-inch fab near near Shanghai. had to do some seriously lobbying before the Taiwanese government would allow a higher tech 12-inch plant to be constructed in China.TSMC is one of Taiwan's top tech companies. TSMC had urged authorities to allow 12-inch facilities, which use more advanced technology processes than the 8-inch plants. Its arguement was that such plants had to be wholly owned out of concern for intellectual property protection.
    Chairman Morris Chang has given out some details on the project saying that a 12-inch fab and its new design service centre will be established in Nanjing.
    “We aim to provide closer support to customers as well as expand our business opportunities in China in step with the rapid growth of the Chinese semiconductor market over the last several years," he said
    When completed, the new plant will make 20,000 12-inch wafers per month. Production will begin in the second half of 2018.
    Noticia:
    http://www.fudzilla.com/news/process...plant-in-china
    http://www.portugal-tech.pt/image.php?type=sigpic&userid=566&dateline=1384876765

  6. #126
    Tech Ubër-Dominus Avatar de Jorge-Vieira
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    TSMC ramps up production on Intel’s modem



    IPhone 7 believed to be the target
    The dark satanic rumour mill has manufactured a hell on earth yarn about TSMC ramping up production of Intel’s XMM 7360 LTE modem.

    The reason the rumour mill is going mental over this particular yarn is because the modem is expected to be in the black heart of the forthcoming iPhone 7.
    Analyst Steve Mullane of BlueFin Research Partners said that TSMC is "planning to double the production starts" of Intel's XMM 7360 LTE modem in the current quarter. The analyst says that this "correlates with the timing of the Apple A10 processor production ramp in preparation for the iPhone 7 launch in September.
    We had been expecting Apple to buy this modem for the iPhone SE as Jobs’ Mob tried to dump Qualcomm’s version. It turned out that the iPhone SE was just the iPhone 5c with a better chip so an improved modem was not needed. There has been a little bit of a panic at Qualcomm which has been running a series of ads in which they claim that their modems are superior to an unnamed "Team Blue's" modems. It is fairly clear that Qualcomm sees Intel’s new modems as a threat.
    The theory is that for phones sold in North America and other regions in which CDMA is popular and wireless specs are important, Apple will use Qualcomm. In regions in which, perhaps, such features are unimportant to potential buyers, the iPhones with Intel inside.
    The Tame Apple Press is hinting that all Apple is doing is getting a second source for LTE modems and wants someone like Intel in place if it needs them. The reason it needs to spin this particularly story is because Apple Fanboys like to make much mock about Intel in the mobile area.
    Having Intel inside an Apple device is terrible if you know nothing about technology but everything about branding – pretty much every Apple fanboy. They are insisting that the XMM 7360 doesn't even have the performance/feature set of the Qualcomm modem that Apple is likely to use in the iPhone 7 this year.
    Noticia:
    http://www.fudzilla.com/news/mobile/...-intel-s-modem
    http://www.portugal-tech.pt/image.php?type=sigpic&userid=566&dateline=1384876765

  7. #127
    Tech Ubër-Dominus Avatar de Jorge-Vieira
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    TSMC's Q1 2016 revenues decline 18 percent



    Low-end, midrange smartphone demand offset February earthquake
    On Thursday Taiwan Semiconductor Manufacturing Company announced an 18 percent quarterly revenue decline for Q1 2016 from the same timeframe a year ago in Q1 2015. The chip manufacturing giant also announced Q1 2016 net profit of $2 billion USD ($64.78 billion TWD), representing an 8.3 percent quarterly profit decline from the same timeframe a year ago in Q1 2015.

    For TSMC, Q1 2016 was marked by a reduction of demand for high-end smartphones, while smartphone demand in China and emerging markets had upward momentum. Beginning Q2 2016 and onward, the company expect to get back onto a growth trajectory and is projected to hit a 5 to 10 percent growth rate in 2016.
    “Our 10-nanometer technology development is on track,” said company president and co-CEO Mark Liu during the company’s Q4 2015 earnings call. “We are currently in intensive yield learning mode in our technology development. Our 256-megabit SRAM is yielding well. We expect to complete process and product qualification and begin customer product tape-outs this quarter.”


    “Our 7-nanometer technology development progress is on schedule as well. TSMC's 7 nanometer technology development leverage our 10-nanometer development very effectively. At the same time, TSMC's 7-nanometer offers a substantial density improvement, performance improvement and power reduction from 10-nanometer.


    These two technologies, 10-nanometer and 7-nanometer, will cover a very wide range of applications, including application processors for smartphone, high-end networking, advanced graphics, field-programmable gate arrays, game consoles, wearables and other consumer products.”
    In Q1 2016, TSMC reached a gross margin of 44.9 percent, an operating margin of 34.6 percent and a net profit margin of 31.8 percent respectively. Going forward into Q2 2016, the company is expecting revenue between ~$6.65 billion and ~$6.74 billion USD, gross margins between 49 and 51 percent, and operating profit margins between 38.5 and 40.5 percent, respectively.



    TSMC first quarter revenues 2014, 2015 and 2016
    Chips used for communications and industrial uses represented over 80 percent of TSMC’s revenue in FY 2015. The company was also able to improve its margins by increasing 16-nanometer production, and like many other semiconductor companies, is preparing for an expected upswing sometime in 2017.
    In February, a 6.4-magnitude earthquake struck southern Taiwan where TSMC’s 12-inch Fab 14 is located, a current site of 16-nanometer production. The company expected to have a manufacturing impact above 1 percent in the region with a slight reduction in wafer shipments for the quarter.
    “Although the February 6 earthquake caused some delay in wafer shipments in the first quarter, we saw business upside resulting from demand increases in mid- and low-end smartphone segments and customer inventory restocking,” said Lora Ho, Senior Vice President and Chief Financial Officer of TSMC.


    “We expect our business in the second quarter will benefit from continued inventory restocking and recovery of the delayed shipments from the earthquake.”


    TSMC 16-nanometer FinFET wafer (via SemiAccurate.com)

    In fiscal year 2016, the company will spend between $9 and $10 billion on ramping up the 16-nanometer process node, constructing Fab 15 for 12-inch wafers in Nanjing, China, and beginning commercial production of the 10-nanometer FinFET process at this new facility. Samsung and Intel are also expected to start mass production of 10-nanometer products by the end of 2016.
    During its Q4 2015 earnings call, company president and co-CEO Mark Liu stated the company is currently preparing and working on a 7-nanometer process node and plans to begin volume production sometime in 2018. Meanwhile, since January 2015, a separate research and development team at TSMC has been laying the groundwork for a 5-nanometer process which the company expects to bring into commercial production sometime in 1H 2020.
    So far in Q1 2016, shipments of 16 and 20-nanometer wafers have accounted for around 23 percent of the company’s total wafer revenues.

    Noticia:
    http://www.fudzilla.com/news/40459-t...ine-18-percent
    http://www.portugal-tech.pt/image.php?type=sigpic&userid=566&dateline=1384876765

  8. #128
    Tech Bencher Avatar de reiszink
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    Apple sozinha a comer 80% da produção 7nm da TSMC. Huawei a comer outros 10%...

    Com o abandono da Global Foundries, basicamente vão lá cair quase todos, não sei como vão dar vazão a tudo.

    https://www.gsmarena.com/tsmc_to_be_...news-32925.php
    Intel i7 5820K - ASRock X99M Killer - 16GB G.Skill DDR4 - Gigabyte GTX 980Ti G1 - Plextor M6e 256GB + Samsung 850 EVO 500GB - Corsair H110 - EVGA G3 750W - Acer 27" 144Hz IPS - Zowie EC2-A - Filco Majestouch 2 TKL - HyperX Cloud II Pro

  9. #129
    Moderador Avatar de Winjer
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    TSMC: 5 nm on Track for Q2 2020 HVM, Ramping Faster than 7 nm

    TSMC vice chairman and CEO C.C. Wei announced the company's plans for 5 nm are on track, which means High Volume manufacturing (HVM) on the node is expected to be achieved by 2Q 2020. The company has increased expenditures in ramping up its various nodes from an initially projected $10 billion to something along the lines of $14 billion - 15 billion; the company is really banking on quick uptake and design wins on its most modern process technologies - and the increased demand that follows.

    TSMC's 5 nm process (N5) will use extreme ultraviolet lithography (EUVL) in many more layers than its N7+ and N6 processes, with up to 14 layers being etched in the N5 silicon compared to five and six, respectively, for its "older" N7+ and N6 processes. As the company increases capital expenditure in acquiring EUVL-capable equipment that sets up its production nodes for the market they foresee will just gobble up the chips in 2020, the company is optimistic they can achieve growth in the 5-10% number.
    A TSMC está mesmo forte. Não tarda nada até mesmo a Intel vai ter de comprar waffers na TSMC, se queiser manter-se competitiva.

  10. #130
    Moderador Avatar de Winjer
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    TSMC would use "gate all around transistors" for 2nm node

    Yes Sir we're already talking about 2nm folks. DigiTimes has an interesting piece up claiming that the 2nm node would introduce something called "gate all around transistors" replacing FinFET with GAA transistors.
    TSMC 2nm GAA process development ahead of schedule: TSMC's development of 2nm process technology, which is already out of its pathfinding mode, is ahead of schedule, according to industry sources. TSMC would switch from the 2N node from the currently common finfet transistors to so-called gaafet transistors, of which nanowires are a alternative. Ultimately, the continued use of finfet transistors will pose unconquerable difficulties. With the current finfet transistors, further reduction produces too much leakage of current. The gate encloses the channel of the finfet transistor on three sides.
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  11. #131
    Moderador Avatar de Winjer
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    TSMC Ends Its Volume Discounts For the Biggest Customers, Could Drive Product Prices Up

    Taiwan Semiconductor Manufacturing Company (TSMC), one of the largest semiconductor manufacturers in the world, is reportedly ending its volume discounts. The company is the maker of the currently smallest manufacturing nodes, like 7 nm and 5 nm. For its biggest customers, TSMC used to offer a discount - when you purchase 10s or 100s of thousands of 300 mm (12-inch) wafers per month, the company will give you a deal of a 3% price decrease per wafer, meaning that the customer is taking a higher margin off a product it sells. Many of the customers, like Apple, NVIDIA, and AMD, were a part of this deal.

    Today, thanks to a report from the Taiwanese Central News Agency, TSMC is terminating this type of discount. Now, every customer will pay full price for the wafer, without any exceptions. For now, it is unclear what drove that decision at TSMC's headquarters, but the only thing that we could think is that the demand is too high to keep up with the discounts and the margins are possibly lower. What this means for consumers is a possible price increase in products that are manufactured at TSMC's facilities. The consumer market is already at a drought of new PC components like CPUs and GPUs due to high demand and scalping. This could contribute a bit to the issue, however, we do not expect it to be of any major significance.
    Já estou a ver os preços do hardware a subirem ainda mais.
    Ryzen R5 3700X / Noctua NH-D15 / B550 AORUS ELITE V2 / Cooler Master H500 Mesh / 16Gb DDR4 @ 3800mhz CL16 / Gigabyte RTX 2070 Super / Seasonic Focus GX 750W / Sabrent Q Rocket 2 TB / Crucial MX300 500Gb + Samsung 250Evo 500Gb / Edifier R1700BT


  12. #132
    Moderador Avatar de Winjer
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    Taiwan says its TSMC-led semiconductor industry has enough water until May


    Speaking to reporters earlier this week, the country’s Minister of Economic Affairs, Wang Mei-hua, said the drought has not yet impacted TSMC or other companies, writes the South China Morning Post. A typical semiconductor manufacturing facility uses two to four million gallons of ultra-pure water per day.


    The global semiconductor shortage, which could last until next year, is the main reason new PC hardware and game consoles are so difficult to find right now—Qualcomm’s incoming CEO says the situation keeps him up at night. It’s also having a devastating effect on the automotive industry, which reduced chip orders at the start of the pandemic and is now struggling to meet demand. With many carmakers pausing vehicle production, US, Japanese and European officials are reportedly urging Taiwan to do all it can to keep the supply of chips steady.



    TSMC spokesperson Nina Kao said the company has reduced its usage and ordered small amounts of water by the truckload in preparation for any restrictions. Any further chip production interruptions, like those caused by Texas fabs temporarily closing due to extreme weather, would exacerbate an already difficult situation. Still, it sounds as if TSMC is prepared for the worst.


    Taiwan recently implemented conservation measures that have helped it save 701 million tons of water, ensuring enough supply until May with an additional one month’s reserve. By that point, the monsoon rains should have arrived.


    Será que o mercado vai ficar ainda pior?
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  13. #133
    Tech Membro Avatar de Whitecupra
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    Citação Post Original de Winjer Ver Post
    Sim vai, e isto é apenas uma goto no oceano...
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    Whitecupra no Twitch

  14. #134
    Moderador Avatar de Winjer
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    Citação Post Original de Whitecupra Ver Post
    Sim vai, e isto é apenas uma goto no oceano...
    Podes crer, é tudo a ajudar á desgraça.
    Ryzen R5 3700X / Noctua NH-D15 / B550 AORUS ELITE V2 / Cooler Master H500 Mesh / 16Gb DDR4 @ 3800mhz CL16 / Gigabyte RTX 2070 Super / Seasonic Focus GX 750W / Sabrent Q Rocket 2 TB / Crucial MX300 500Gb + Samsung 250Evo 500Gb / Edifier R1700BT


 

 
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